Lumpi Ltd has developed a novel technology to add quantum entangled photon emission capabilities to any semiconductor device whether this is an electronic chip, a photonic integrated circuit (PIC) or an electronic board. The technology is based on the LIFT manufacturing process which the company owner Dr. Ioannis Metsios has developed during his PhD study for the transfer on chalcogenide wide bandgap semiconductors. The process has been refined further to match the needs of the quantum device industry in 2019 and in a more recent work funded by InnovateUK (project 10032529) under the ISCF Commercialising quantum technologies competition, within the project Quantum element Interposition by Laser Transfer (QuILT) project that has been completed in June 2024.
The technology is utilising pulsed laser energy sources to conduct forward transfer of layers and in this case nanoparticles from an original carrier substrate where they were formed for example, locally, onto any new substrate, without impacting the properties or functionality of the receiving substrate or device. As a result, the nanoparticles can be added onto existing semiconductor devices. As certain nanoparticles can achieve quantum entanglement of photons in the form of spontaneous down conversion or as single photons or otherwise entangled photons in energy or momentum as “squeezed light”, this entails that we can add the capability to any circuit to act as a source of entangled photons and thus operate as a quantum enabled device.
In the near future, Lumpi Ltd is open to collaborations with the aim of developing this technology further and delivering to the market early stage, simple quantum devices, like communications ICs or sensors. At a later stage, the technology can be employed in constructing more complex devices with multiple elements.
The QuILT project was contacts in collaboration with Essex AI from the university of Essex and Micron Semiconductors Ltd.
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